The Si wafer is a substrate, and a dollop of solution is placed on top of it.

When spun at high speeds, the inertia of the solution causes it to be ejected radially outward, represented here by red arrows.

Because of this ejection, the height of the solution is decreased and a thin film is eventually achieved.


Module Information
Authors:Yitzi Calm
Topics:manufacturing, fabrication
Audience College
Keywords: spin coating
Release: Alpha Beta Gold

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